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M470T6554EZ3-CE6 Samsung 1gb PC2-5300 DDR2-667

$11.77

M470T6554EZ3CE6 Samsung 512MB PC25300 DDR2667 nonECC Unbuffered CL5 SoDimm Dual

Only 1 left in stock

SKU: M470T6554EZ3-CE6 Categories: , , , Tags: ,

Description

These are two (2) used memory modules M470T6554EZ3-CE6 in good working condition. The Item includes two (2) modules: 1gb = 2 x 512mb

M470T6554EZ3-CE6 Technical Specifications

ManufacturerSamsung
Manufacturer Part #M470T6554EZ3-CE6
Memory TypeSODIMM
Capacity512MB
Pins200 Pin
Bus TypePC-5300
Error CorrectionNon-ECC
Cycle Time6ns
CasCL5
Data Transfer Rate667Mhz
Memory Clock166Mhz
RankRank 2
Voltage1.8

 

factsheet global pioneer, global leader

FactsheetGlobal pioneer, global leader

Our fact sheet has all you need to know about our recent history, our achievements, and our plans for the future.

Global Operation

Korea: 42,000 employees in 3 campuses
Worldwide: 10,000 employees in 4 Production Sites, 7 R&D Centers and 5 Regional HQs

Memory

DRAM (Dynamic Random Access Memory)

Samsung has been the undisputable, long-time leader in the DRAM sector and produces the most up-to-date DRAM solutions including components and modules for PC, server and mobile applications. Since 2013, Samsung has been the only manufacturer producing DDR4 devices based on 20 nanometer process technology. As the pioneer of advanced DRAM technologies, Samsung offers DDR3 as well as DDR4 solutions with the highest performance and the highest density as well as the lowest power consumption.

Samsung Now Mass Producing Industry’s Most Advanced 4Gb DDR3, Using 20 Nanometer Process Technology

Samsung announced that it is mass producing the most advanced DDR3 memory based on a new 20nm process technlogy, pushing the envelope of DRAM scaling while utilizing immersion ArF lithography.

Samsung Now Mass Producing Industry’s Most Advanced DDR4, using 20 Nanometer-class Process Technology

Based on Samsung’s 20nm-class DRAM, the world’s highest performing and smallest 4Gb DRAM chip, the industry’s largest lineup of products tailor to applications from servers to mobile devices. This will provide global customers with the widest range of highly advanced low-power, high-performance green memory solutions.

Samsung First to Begin Mass Production of High-speed 20nm-class 4 Gigabit DDR3 based 8 Gigabyte Memory for Mobile Enterprise Servers and Premium Notebook PCs

Samsung delivered the industry’s highest density 8GB module, which is based on its advanced 20nm-class 4Gb DDR3 chip. Designed for use in advanced mobile enterprise servers and premium notebook PCs, this 8GB SoDIMM provides a 40-percent increase in performance while more than doubling power efficiency, with a consumption level of 1.5 watts per hour (compared to a 30nm-class 4GB module).

 
       

Additional information

Weight0.2 lbs
Dimensions5.500 × 1.500 × 0.200 in
Condition

Manufacturer